1.Dispensing technology is widely used to apply adhesives, sealants, or coatings with precision in 3C products (e.g., smartphones, laptops, wearables)
2.Soldering joins electronic components to PCBs (Printed Circuit Boards) in devices like routers, smartwatches, and motherboards.
3.Screws assemble structural parts of 3C devices (e.g., laptop housings, smartphone frames).
4.AOI systems inspect PCBs and assemblies for defects without contact.
5.Wire bonding creates electrical connections between semiconductor dies and PCB leads in IC packaging (e.g., chips in smartphones).
These technologies—dispensing, soldering, screw fastening, AOI, and wire bonding—are essential for 3C electronics manufacturing, ensuring precision, durability, and efficiency in producing consumer gadgets. Automation and AI-driven tools (like AOI) further enhance quality in this fast-evolving industry.
