Aluminum Copper Wire Bonder Ultrasonic Wire Bonding Machine for MOS Leading Frame

Ultrasonic bonding machines (also called ultrasonic welders or ultrasonic metal/wire bonders) are advanced industrial systems that use high-frequency ultrasonic vibrations to join materials without external heat, soldering, or adhesives. These machines are widely used in electronics, automotive, medical devices, and semiconductor packaging for creating strong, reliable bonds in delicate assemblies.

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Product Detail

Product Tags

New energy power batteries, photovoltaic inverters, automotive electronics, energy storage, IGBT, BMS battery safety control boards, etc

Product Specification

XY Motion Range	100mm (X) × 100mm (Y)
XY Motion Accuracy	Linear Motor, 0.1μm resolution
Ultrasonic Bonding	±0.02mm (includes image/wire/capillary/application alignment)
Repeatability & Power	180‒240V, AC single-phase, 50/60Hz,4.0kVA
Equipment Dimensions	1820mm × 1260mm × 1700mm
Z-Axis Travel & Accuracy	Voice Coil Motor, 50mm travel (Z-axis), 0.1μm resolution
R-Axis	Torque Motor Drive, ±220°, 0.1μm resolution
Control System	Industrial PC + servo drive
Compressed Air Pressure/Optional	0.5‒0.7MPa, clean dry air
Weight	1200kg

Bonding Wire Materials

GR-W02 Heavy Wire Bonder is specifically designed for large-diameter wire bonding in IGBTs, intelligent power modules, and hybrid assemblies, delivering a stable and reliable professional solution.

Copper Wire

Aluminum Wire

Copper Ribbon

Aluminum Ribbon

What do you need to bond?

Chips? MEMS devices? LEDs? Or something else?

Application scope

MOSFET packages (TO220, TO220F, TO247, TO252, TO263, etc.) in single-row or multi-row configurations, DBC-based IGBT modules,and other power semiconductor devices.

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