Application

应用

Green Intelligent offers a comprehensive “5+1+2” product matrix, encompassing laser soldering, glue dispensing, screw fastening, selective soldering, AOI/SPI, non-standard automation solutions, semiconductor equipment, and new energy UV printing systems.

Industrial Applications

GREEN is a National High-Tech Enterprise dedicated to R&D and manufacturing of automated electronics assembly and semiconductor packaging & testing equipment.Serving industry leaders such as BYD, Foxconn, TDK, SMIC,Canadian Solar, Midea, and 20+ other Fortune Global 500 enterprises. Your trusted partner for advanced manufacturing solutions.

3C Electronics

Used for soldering various electronic components, such as electric LED, switches, chargers, electro-acoustic products, transformers, PCBs, and other components,ect.

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LED

Lens sealing via dispensing, driver circuit soldering, heatsink fastening with screws, chip inspection by AOI, and wafer interconnects through bonding machines

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Semiconductor

Semiconductor manufacturing ensures chip reliability through tightly controlled processes: front-end AOI inspection, mid-end bonding for interconnects, and back-end packaging equipment.

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Medical Devices

Precision soldering for sensors,Screw fastening of imaging equipment,Microchannel AOI inspection,Biochip bonding

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New Energy

Dispensing, soldering, screw fastening, AOI, and wire bonding – these five key technologies ensure safety, efficiency, and durability in new energy equipment.

 

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Automotive Electronics

ECU sealing via dispensing ,Laser soldering for sensors ,Torque-controlled screw fastening of domain controllers ,Automotive-grade PCB inspection by AOI ,Power module packaging via bonding machines

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WHAT IS YOUR INDUSTRY ?

Dedicated to providing automated assembly and semiconductor packaging & testing solutions

What Kinds of Industria Intelligent Equipment We Can Supply For Your Projects?

1. High-speed automated dispensing machine

2. Automated soldering machine

3. Automated screw fastening machine

4. Selective soldering machine

5. Semiconductor aluminum/copper wire bonder

6. AOI and SPI machine

7. Semiconductor equipment and new energy UV printing systems

8. Non-standard automation solutions

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