Solder Ball Laser Soldering Machine LAB201
Mechanism Specification
|
Model |
LAB201 |
|
|
Laser parameters |
Power |
150W |
|
Wavelength |
1064 |
|
|
Mode |
Continuous pulse fiber lasers |
|
|
Solder ball specifications |
0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Optional) |
|
|
Visual positioning system |
CCD, resolution ± 5 um |
|
|
Camera pixels |
5 million pixels |
|
|
Control mode |
PLC+PC Control |
|
|
Repeatability accuracy |
士0.02mm |
|
|
Processing range |
200mm*150mm(Customized) |
|
|
Working power |
<2KW/H |
|
|
Air source |
Compressed air>0.5 MPa nitrogen > 0.5 MPa |
|
|
Outer dimension(L*W*H) |
1000*1100*1650(mm) |
|
|
Weight |
500KG |
|
Features
1.The heating speed is fast, and the positioning is accurate, which can be completed in 0.2 seconds;
2.The solder balls are ejected from the special nozzle and directly cover the pads.
3.No additional flux or other tools are needed, no pollution generated, maximizing the lifespan of electronic devices;
4.Supporting a minimum diameter of 0.15mm for tin balls, this laser tin ball welding equipment conforms to the development trend of integrated and precision production equipment;
5.Different solder joints can be welded by selecting the size of the solder ball;
6.Stable welding quality and high yield rate;
7.Cooperate with CCD positioning system to meet the needs of large-scale production on assembly lines;
8.UPH ≥ 8000 points, yield ≥ 99% (related to product material and consistency).
