In-line AI Version Top and Bottom Lighting AOI Machine Automated Optical Inspection System for PCBA Wave Soldering

AOI (Automated Optical Inspection) is a high-precision vision-based inspection system widely used in manufacturing, particularly in the electronics industry, to detect defects and ensure product quality. By utilizing advanced imaging technology and intelligent algorithms, AOI systems automatically scan and analyze components such as PCB (Printed Circuit Boards), semiconductor wafers, displays, and assembled electronic devices for flaws without human intervention.

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Product Detail

Product Tags

Application Fields

Aviation, smartphones, automotive manufacturing, tablets, FPCs, digital appliances, displays, backlights, LEDs, medical devices, Mini LEDs, semiconductors, industrial controls, and other electronics fields.

Inspection Defects

Post-wave soldering defects: contamination, solder bridging, insufficient/excess solder, missing leads, voids, solder balls, wrong missing components, etc.

Main Configuration Specifications

AI Intelligent Assisted Modeling: Rapid modeling without parameter setup.
Core Features: Deep learning algorithms, fast programming, high-precision model training, remote control.
One-Click Intelligent Search: Supports 80+ component types, compatible with morphological variations. Automatically identifies components and classifies defects.
Online First-Board Snapshot System for Automated Program Diagram Generation.
Powerful Learning Capability: Supports continuous incremental learning (improves with more training).
Advanced Character Recognition Functionality: Accurately identifies diverse characters with high efficiency.
Top imaging, bottom imaging, and dual imaging (top + bottom) are flexibly configurable to adapt to multiple scenarios.
Multi-task software architecture design and testing, synchronously support on-line editation in real time, with automatic synchronization upon saving.
SPC	Provides real-time statistical analysis data and diverse statistical charts
Voice Broadcast	Supported
Multi-Project Inspection	Co-line production for multiple types of machines (6 options available)
Board Conveyance Direction	Dual-direction flow
Multi-Project Inspection	Supported
Inspection Items	Bottom imaging inspection (Soldering Defects): Short circuits, exposed copper, missing leads component absence, pinholes, insufficient solder, SMT component body, and soldering issues.
Custom Voice Alerts	Supported
Remote Control & Debugging	Supported
Communication Interface	SMEM4 interface
Hardware Configuration	Light Source	RGB or RGBW Integrated Ring Light
	Lens	15/20μm High-Precision Lens
	Camera	12-Megapixel High-Speed Industrial Camera
	Computer	Intel i7 CPU / NVIDIA RTX 3060 GPU /64GB RAM / 1TB SSD / Windows10
	Monitor	22" FHD Display
	Dimension	L1100 × D1450 × H1500 mm
Power Consumtion	AC 220V±10%, 50Hz
Machine weight	850KG