Aluminum Copper Wire Bonder Ultrasonic Wire Bonding Machine for High Power IGBT Battery LED PCBA

Ultrasonic bonding machines (also called ultrasonic welders or ultrasonic metal/wire bonders) are advanced industrial systems that use high-frequency ultrasonic vibrations to join materials without external heat, soldering, or adhesives. These machines are widely used in electronics, automotive, medical devices, and semiconductor packaging for creating strong, reliable bonds in delicate assemblies.

Send email to us

Product Detail

Product Tags

Bonding Wire Materials

Heavy Wire Bonder is specifically designed for large-diameter wire bonding in IGBTs, intelligent power modules, and hybrid assemblies, delivering a stable and reliable professional solution.

Copper Wire

Aluminum Wire

Copper Ribbon

Aluminum Ribbon

What do you need to bond?

Chips? MEMS devices? LEDs? Or something else?

Cantact Us

Technical Specification

X-Axis	300 mm / Customizable Stroke (Optional)
Y-Axis	300 mm / 800 mm, Customizable Stroke (Optional)
Z-Axis	Standard 50 mm, Optional 50‒100 mm
R-Axis	AC Servo Motor with Absolute Encoder (±220°), Resolution: 0.0035°
Height (Excluding Signal Light)	1815 mm
Weight	1400 kg
Working Height	SEMI MA850‒1050 mm Standard
Power Supply	220V
Power Consumption	1kW
Compressed Air Requirement	0.5‒0.7 MPa (Clean, Dry Air)
Dimensions (L × W × H)	75012001850 mm

Machine Specification

Image recognition
Image Size	Traditional Image Recognition
Recognition Time	Each Recognition Cycle ≤2 ms
Alignment Correction	FlexSearch; Single-Point Recognition (Including Phase Angle), Dual-Point Recognition
Camera	Phase Angle Correction: ±5%
Resolution	Moving CCD Camera with Micron-Level Pixel Accuracy
Image Size	2‒30 μm/Pixel (Adjustable via Optical Components)

Automatic tooling mode
Pin-Type Stepper Transmission	Belt-Driven Stepper Transmission
Packaging Form	Flat Substrates (e.g., Ceramic Substrates, PCBs, or Workpiece Trays)
Automatic Conveyor Line	Customizable Automated Handling (AGV Mode Available)
Tandard Effective Welding Stroke	300300,300800(mm)
Customizable Stroke	Expandable Travel Range (e.g., for Automotive Battery Packs)

Machine specifications
X-Y Axis	Linear Encoder Resolution <0.1 μm
R Axis	±220° AC Servo Motor with Absolute Encoder (Resolution: 0.0035°)
Z Axis	Optional 60 mm (2.36") Stroke with AC Servo Motor (Resolution: 0.5 μm)
Positioning Accuracy	<±5 μm @3σ (Includes Image/Wire/Bonder/Application)
Repeatability on Product	<±3 μm @3σ (Includes Image/Wire/Bonder/Application)
Display	21" Flat Display
Microscope	Stereo Zoom Microscope with Adjustable Lighting
Connection	SMEMA、USB、RJ45、Digital 1/0
Operating System	Real-Time Unix?-Based Multitasking OS
Certification	SEMIS2、CE

Application scope

New energy power batteries, PV inverters, Frequency converters, Automotive electronics, Energy storage systems, IGBT modules,BMS (Battery Management System) safety control boards.